Thermalpas field deployment (Taiwan) · Heavy Industry
Semiconductor packaging house: 0.8% yield improvement on UV-cure lines
Cleanroom-rated thermal control of UV-cure lamp rollers.
- 0.8%Yield improvement
- $8M/yrPlant-reported yield value
- Class-100Cleanroom-certified
The problem
A semiconductor packaging house uses UV-cure lamps to set the resin that seals each chip. Too hot and the substrate develops thermal stress; too cool and the resin doesn't fully cure and the part fails QC. General-purpose sensors are not allowed in the cleanroom because they shed particles.
What was installed
A Class-100 cleanroom-certified Thermalpas variant — same patented adhesive and accuracy, in cleanroom-rated packaging — was installed. The cure curve was recorded for every roller and batch, building a fingerprint of good versus bad cure that QC can audit.
The outcome
The packaging plant's yield improved by 0.8%; on $1 billion of annual output, the plant values that at $8 million a year in additional yield. It reports payback within the first quarter.
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