01 The Problem
A semiconductor packaging house uses UV-cure lamps to set the resin that seals each chip. Too hot and the substrate develops thermal stress; too cool and the resin doesn't fully cure and the part fails QC. Standard sensors aren't allowed in cleanrooms because they shed particles and contaminate the production environment.
The Risk
UV-cure lamp roller temperature too high causes substrate thermal stress; too low causes incomplete resin cure.
Detection Gap
Cleanroom environments prohibit general sensors (dust contamination).